PVA Tepla Corporation Microwave Plasma Treatment Device (for Pre-Processing)
From batch processing equipment equipped with unique wafer transfer machines to sheet processing equipment, they are used in fabs around the world for MEMS and semiconductors.
By exciting high-density plasma with 2.45GHz microwaves and suppressing the kinetic energy of ions, it is possible to achieve damage-free process results. It is designed to accommodate a wide range of applications, including ashing in wafer processes, resist stripping, SU-8 resist ashing for MEMS, descum processing, and surface cleaning and activation of substrates.
- Company:伯東 本社
- Price:Other